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Appendix I

Reference Manual

Technical Bibliography

The articles listed here describe the scientific basis of C-MOLD software and other specializations of our company. To request copies of these articles or for more information contact:

AC Technology
Warren Road Business Park
31 Dutch Mill Road
Ithaca, New York 14850
Tel: (607) 257-4280 · Fax: (607) 257-6355

Injection Molding/General

 L.S. Turng, H.H. Chiang, and J.F. Stevenson, "Optimization Strategies for Injection Molding," SPE Technical Papers, XLI, Vol. 1, pp. 668-672 (1995).

K. Himasekhar, H.H. Chiang, N. Santhanam, L.S. Turng and K.K. Wang, "The Role of Computer Aided Engineering in Computer Integrated Manufacturing," Chapter 6 in Computer Integrated Manufacturing (CIM) in Plastics Processing Plants, Ed. Keith T. O'Brien, Hanser Publishers, (1995).

K.K. Wang, "Twenty Years of CIMP Research Towards CAE for Injection Molding," Advances in Computer-Aided Engineering (CAE) of Polymer Processing ASME, Ed. K. Himasekhar ed al., MD-Vol. 49/HTD-Vol. 283, pp. 1-5, (1994).

H.H. Chiang, K. Himasekhar, N. Santhanam and K.K. Wang, "Integrated CAE Analysis for Fiber Filled Plastics in Injection-Molding," Advances in Computer-Aided Engineering (CAE) of Polymer Processing ASME, Ed. K. Himasekhar ed al., MD-Vol. 49/HTD-Vol. 283, pp. 247-264, (1994).

P.L. Media, "How To Successfully Utilize CAE Simulation Software For Plastic Part, Mold and Process Design," SPE Technical Papers, XXXIX, Vol. 1, pp. 1632-1635 (1993).

H.H. Chiang & C.A. Hieber, "Spiral-Flow Analysis Including Variable-Density Effects," SPE Technical Papers, XXXIX, Vol. 1, pp. 102-107 (1993).

M. Gupta and K.K. Wang, "Effect of Processing Conditions on Fiber Orientation in Injection-Molded Composites," SPE Technical Papers, XXXIX, Vol.2, pp. 2290-2295 (1993).

S.F. De Fosse, H.R. Fister & D.T. Tyler, "Using Process Simulation to Optimize Tooling Cost and Performance of an Injection Molded Printer Chassis," SPE Technical Papers, XXXIX, pp. 108-113 (1993).

A. Doll & W.R. Goodberlet, "Advantages of Experienced-Based Processing Information in Flow Analysis," presented at Mold Filling and Cooling Analysis Conference (Society of Manufacturing Engineers), Dearborn, Michigan (August 24-25, 1993).

K. Himasekhar, L.S. Turng, V.W. Wang, H.H. Chiang, T.Y. Chen, W.R. Jong, N. Santhanam & K.K. Wang, "Current Trends in CAE: Simulations of Latest Innovations in Injection Molding," presented at Advances in Polymer Processing, 2nd International Conference (Innovative Technologies for Novel Products), New Orleans, Louisiana (March 23-25, 1992).

S. Barton & P. Medina, "CAE Plastic Simulation for Innovative Processes: How to Use it Successfully," Society of Manufacturing Engineers (1992).

K.K. Wang, K. Himasekhar, H.H. Chiang, W.R. Jong & V.W. Wang, "Integrated CAE of Injection Molding Using a Three-layer Approach," SPE Technical Papers, XXXVII, pp. 267-273 (1991).

C. Cohen, C.A. Hieber, K. Himasekhar, S.F. Shen & K.K. Wang, "Recent Findings in Injection Molding Research," in Advances in Manufacturing Systems Integration and Processes Conference, proceedings of the 15th Conference on Production Research and Technology, pp. 585-589 (January 1989).

K.K. Wang & V.W. Wang, "Computer-Aided Mold Design and Manufacturing," Chapter 9 in Injection and Compression Molding Fundamentals, Ed. Avraam I. Isayev, Mercel Dekker, NY, pp. 607-669 (1987).

C.A. Hieber, V.W. Wang & K.K. Wang, "C-FLOW: A CAE Package with High-Level Interactive Graphics, " Chapter 7 in Applications of Computer Aided Engineering in Injection Molding, Ed. Louis T. Manzione, Hanser Publishers, pp. 230-246 (1987).

C.A. Hieber , V.W. Wang & K.K. Wang, "Dynamic Simulation and Graphics for the Injection Molding of Three-Dimensional Thin Parts," Journal of Polymer Engineering, Vol. 7, No. 1, pp. 21-45 (1986).

C.A. Hieber , V.W. Wang & K.K. Wang, "An Interactive Simulation of Cavity Filling in Injection Molding with Color Graphics," SPE Technical Papers XXXI, pp. 826-829 (1985).

B. Chung, C.A. Hieber, V.W. Wang & K.K. Wang, "The Effects of Processing Conditions on the Pressure Losses in a Runner-Gate-Cavity System," SPE Technical Papers XXX, pp. 769-771 (1984).

C.A.Hieber, V.W. Wang & K.K. Wang, "An Interactive Computer Program for Runner-System Design in Injection Molding," SPE Technical Papers XXIX, pp. 663-665 (1983).

C.A. Hieber & S.F. Shen, "A Finite-Element/Finite-Difference Simulation of the Injection-Molding Filling Process," Journal of Non-Newtonian Fluid Mechanics, Vol. 7, pp. 1-32 (1980).

C.A. Hieber & S.F. Shen, "Flow Analysis of the Non-Isothermal Two-Dimensional Filling Process in Injection Molding," Israel Journal of Technology, Vol. 16, pp. 248-254 (1978).

Injection Molding/Warpage Analysis

P. Foss, J. Harris, J. O'Gara, L. Inzinna, E. Liang, C.M. Dunbar, C. Tucker III, and K. Heitzmann, "Prediction of Fiber Orientation and Mechanical Properties Using C--MOLD and ABAQUS," SPE Technical Papers, XLII, Vol. I pp. 501-505 (1996).

R.M. Shay, Jr., P.H. Foss, and C.C. Mentzer, "Comparison of C-MOLD Predictions and Experimental Shrinkages," Proceedings of the 1995 Automotive RETEC (November 1995).

L. Kudryavtsev, N. Santhanam & K.K. Wang, "Comparison of Flat Thin-shell Finite Elements for Structural Analysis of Injection-Molded Parts," SPE Technical Papers, XXXIX, pp. 88-90 (1993).

M. Gupta and K.K. Wang, "Effect of Processing Conditions on Fiber Orientation in Injection-Molded Composites," SPE Technical Papers, XXXIX, Vol.2, pp. 2290-2295 (1993).

A.G. Gennari, "An Experimental Validation of a Shrinkage/Warpage Predictor - Part II," SPE Technical Papers, XXXIX, pp. 3436-3440 (1993).

S.J. Ni & K.K. Wang, "An Analytical and Experimental Study of Warpage and Shrinkage of an Injection-Molded Part," SPE Technical Papers, XXXIX, pp. 1612-1617 (1993).

M. Warchola, "Combining Structural and Mold Filling Analysis for Optimization in the Design of Vinyl Components," SPE Technical Papers, XXXIX, Vol. 3, pp. 2588-2589 (1993).

H.H. Chiang, K. Himasekhar, N. Santhanam & K.K. Wang, "Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage," Journal of Engineering Materials and Technology; Vol. 115, pp. 37-47, (January 1993).

H.H. Chiang, K. Himasekhar, N. Santhanam, P. Tuschak & K.K. Wang, "Post-Molding and Load-Induced Deformation Analysis of Plastic Parts in the Injection Molding Process," Advances in Polymer Technology, Vol. 11, No. 2, pp. 77-89 (1992).

H.H. Chiang, M. Gupta, K. Himasekhar, N. Santhanam, P. Tushak & K.K. Wang, "Prediction of Fiber Orientation and Mechanical Properties in Short-Fiber Reinforced Injection-Molded Composites", Computer Aided Design in Composite Material Technology III, Ed. S.G. Advani et. al., Computational Mechanics Publications, (Southampton, Boston) co-published with Elsevier Applied Science (London, New York), pp. 371-382 (1992).

H.H. Chiang, C.A. Hieber & K.K. Wang, "A Unified Simulation of the Filling and Post-Filling Stages in the Injection-Molding, Part I: Formulation; Part II: Experimental Verification," Polymer Engineering & Science, Vol. 31, No. 2, pp. 116-139 (1991).

H.H. Chiang, K. Himasekhar, S. Lautenbach, N. Santhanam & K.K. Wang, "Assessment of Shrinkage and Warpage Using an Integrated Analysis of Molding Dynamics," SPE Technical Papers, XXXVII, pp. 242-246 (1991).

C.A. Hieber & V.W. Wang, "Post-Filling Simulation of Injection Molding and Its Applications," SPE Technical Papers, XXXIV, pp. 290-293 (1988).

H.H. Chiang, C.A. Hieber & G. Vandenengel, "Cavity-Pressure Variations During the Post-Filling Stage of Injection Molding," SPE Technical Papers, XXXII, pp. 181-184 (1986).

Artificial Intelligence Applications

W.R. Jong, K. Himasekhar, H.H. Chiang & K.K. Wang, "An Integrated Design Program for Injection Molding Process," SPE Technical Papers, XXXIX, pp. 91-97 (1993).

S. Lautenbach, H.H. Chiang, W.R. Jong & K.K. Wang, "Automatic Interpretation of Weld/Meld Lines in Injection Molding: Experimental Verification," SPE Technical Papers, XXXVII, pp. 372-376 (1991).

W.R. Jong & K.K. Wang, "Automatic and Optimal Design of Runner Systems in Injection Molding Based on Flow Simulation," SPE Technical Papers, XXXVI, pp. 385-389 (1990).

W.R. Jong & K.K. Wang, "Automatic Interpretation of Weld Lines and Air Traps in Injection Molding by Synthesizing Deterministic and Heuristic Knowledge," SPE Technical Papers, XXXVI, pp. 197-202 (1990).

W.R. Jong & K.K. Wang, "An Intelligent System for Resin Selection," SPE Technical Papers, XXXV, pp. 367-370 (1989).

Co-Injection & Gas-Assisted Injection Molding

L.S. Turng, "Development and Application in CAE Technology for the Gas-Assisted Injection Molding Process," Advances in Polymer Technology, Vol. 14, No. 1, pp. 1-13 (1995).

K.S. Barton & L.S. Turng, "General Design Guidelines for Gas-Assisted Injection Molding Using a CAE Tool," SPE Technical Papers, XXXXL, pp. 421-425 (1994).

S.C. Chen, K.F. Hsu, K.S. Hsu & M.C. Jeng, "Numerical Simulations and Experimental Studies of the Co-injection Molding Process," SPE Technical Papers, XXXIX, pp. 82-86 (1993).

L.S. Turng, "New Developments in CAE Technology for the Gas-Assisted Injection Molding Process," SPE Technical Papers, XXXIX, pp. 74-78 (1993).

P.L. Medina & L. S. Turng, "Utilizing Gas Flow Simulaton to Design Gas-Assisted Injection Molded Products," Proceedings of Structural Plastics '93, San Francisco, California pp.124-133 (April 25-28, 1993).

L.S. Turng, "Computer-Aided-Engineering for the Gas-Assisted Injection Molding Process," SPE Technical Papers, XXXVIII, pp. 452-456 (1992).

L.S. Turng, V.W. Wang & K.K. Wang, "Numerical Simulation of the Co-Injection Molding Process," Transactions of the ASME, Vol. 115, pp.48-53 (January 1993).

P.L. Medina, L.S. Turng & V.W. Wang, "Understanding and Evaluating Gas-Assisted Injection Molding Applications via Computer Simulation," Proceedings of the SPI Structural Plastics Division 19th Annual Conference, Atlanta, Georgia (1991).

L.S. Turng & V.W. Wang, "Simulation of Co-Injection and Gas-Assisted Injection Molding," SPE Technical Papers, XXXVII, pp. 297-300 (1991).

M. Hansen & H. Potente, "Comparison Between Experiment And Simulation For The Gas-Assisted Injection Molding Process," International Polymer Processing, VIII, p. 4 (1993).

Mold Cooling

J. A. Henz and K. Himasekhar, "Design Sensitivities of Mold-Cooling CAE Software: An Experimental Verification," Advances in Computer-Aided Engineering (CAE) of Polymer Processing ASME, Ed. K. Himasekhar et al., MD-Vol.49/HTD-Vol. 283, pp. 117-135, (1994).

K. Himasekhar, J. Lottey & K.K. Wang, "CAE of Mold Cooling in Injection Molding Using a Three-Dimensional Numerical Simulation," ASME Journal of Engineering for Industry, Vol. 114, pp. 213-221 (1992).

K. Himasekhar, J. Lottey & K.K. Wang, "Design of a Cooling System in Injection Molding: Use of a CAD Tool," SPE Technical Papers, XXXVI, pp. 1103-1106 (1990).

K. Himasekhar & K.K. Wang, "C-COOL: A CAE Tool for the Design of Cooling System in Injection Molding," presented at the Sixth Annual Meeting of the Polymer Processing Society, (1990).

L.S. Turng & K.K. Wang, "A Computer-Aided Cooling-Line Design System for Injection Molds," Journal of Engineering for Industry, Vol. 112, pp. 161-167 (1990).

K. Himasekhar, "Numerical Simulation of Mold Heat Transfer of Injection Molded Plastic Parts Using a Modified Three-Dimensional Boundary Element Method," International Communications in Heat and Mass Transfer, Vol. 16, No. 1, pp. 55-64, (January-February 1989).

K. Himasekhar, C.A. Hieber & K.K. Wang, "Computer-Aided Design Software for Cooling System in Injection Molding," SPE Technical Papers, XXXV, pp. 352-355 (1989).

K. Himasekhar, J. Lottey & K.K. Wang, "Cooling in Injection Molding: A Three-Dimensional Numerical Simulation," Conference Proceedings, Supercomputers: Emerging Applications in Manufacturing, pp. 3-1/3-11, (September 1989).

K. Himasekhar, K.K. Wang & J. Lottey, "Mold-Cooling Simulation in Injection Molding of Three-Dimensional Thin Plastic Parts," 1989 National Heat Transfer Conference, ADME HTD, Vol. 110, pp. 129-136 (1989).

Reactive Processes

L.T. Nguyen, "Reactive Flow Simulation in Transfer Molding of IC Packages," presented at The 43rd. IEEE Electronic Components & Technology Conference, Buena Vista, Florida (June 1-3, 1993)

T.Y. Chen & V.W. Wang, "A Unified Simulation for Reactive Polymer Processing: RIM, SRIM, and RTM," SPE Technical Papers, XXXIX, pp. 2421-2425 (1993).

V.W. Wang & L.S. Turng, "Simulation of Injection Mold Filling and Curing with Reactive Materials," SPE Technical Papers, XXXVII, pp. 1265-1267 (1991).

Microelectronic Encapsulation

T.H. Kuah, P.H. Yeung, C. Vath III, and N. Srikanth, "Flow Molding of PQFP During Transfer Molding," Journal of Electronics Manufacturing, Vol. 6, No. 2 (June 1996).

L. S Turng, "Computer-Aided Engineering (CAE) for the Microelectronic Packaging Process," Advances in Computer-Aided Engineering (CAE) of Polymer Processing ASME, Ed. K. Himasekhar et al., MD-Vol.49/HTD-Vol. 283, pp. 191-208 (1994).

S. Han & K.K. Wang, "Reduction of Wire Sweep During Chip Encapsulation By Runner Balancing and Ram Control," Advances in Computer-Aided Engineering (CAE) of Polymer Processing ASME, MD-Vol.49/HTD-Vol. 283, pp. 175-190 (1994).

S. Han and K.K. Wang, "Analysis of Wire Sweep Related to Encapsulation of Semiconductor Chips," SPE Technical Papers, XXXIX, Vol.2, pp. 153-157 (1993).

L.S. Turng & V.W.Wang, "On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound," SPE Technical Papers, XXXVIII, pp. 84-88 (1992).

A. Danker, L.T. Nguyen, C.R. Shervin & N. Santhiran, "Flow Modeling of Wire Sweep During Molding of Integrated Circuits," ASME Winter Annual Meeting (November 1992).

Blow Molding And Thermoforming

K. Himasekhar, N. Santhanam & K.K. Wang, "A Design Tool for Blow Molding and Thermoforming Processes," to be presented at The Fifth International Conference on Numerical Methods in Industrial Forming Processes, Ithaca, New York (June 18-21, 1995)

P.L. Medina, "Parison Modeling," Proceedings of the SPI International Plastics Exposition and Conference , Chicago, IL (1994).

D.A. Nutter, "Comparing Actual Injection Blowmolded Parts to Computer Generated Injection Blowmolded Parts," SPE Technical Papers, XXXXL, pp. 3544-3547 (1994).

H. deLorenzi & H. Nied, "Finite Element Simulation of Thermoforming and Blow Molding," Chapter 5 in Progress in Polymer Processing, Ed. A.I. Isayev, Hanser Publishers, pp. 118-171 (1991).

C.A. Taylor, "Finite Element Simulation of Blowmolding," Proceedings of the SPI Structural Plastics Division 18th Annual Conference (1990).

H. deLorenzi, H. Nied & C. Taylor, "A Numerical/Experimental Approach to Software Development for Thermoforming Simulations," ASME Computational Experiments Conference Proceedings, pp. 1-14 (1989).

C.A. Taylor, "Blow Molding - Process Characterization and Finite Element Modeling," SPE Technical Papers, XXXV, pp. 435-437 (1989).

H. deLorenzi, H. Nied & C.A. Taylor, "Finite Element Simulation of Thermoforming - Experiments and Analyses," SPE Technical Papers, XXXV, pp. 931-933 (1989).

H. deLorenzi, H. Nied & C.A. Taylor, "Simulation and Analysis of Blow Molding Using the Finite Element Method," SPE Technical Papers, XXXIV, pp. 797-799 (1988).

H.G. deLorenzi & H.F. Nied, "Finite Element Simulation of Thermoforming and Blow Molding," SPE Technical Papers, XXXIII, pp. 418-420 (1987).

Material Properties

H.H. Chiang & C.A. Hieber, "Spiral-Flow Analysis Including Variable-Density Effects," SPE Technical Papers, XXXIX, pp. 102-107 (1993).

M.J. Bozarth, T.Y. Chen & V.W. Wang, "Crystallization and Its Effect on the Processing on Polypropylene," SPE Technical Papers, XXXVIII, (1992).

H. Lobo & A. Mekkaoui, "Characterization and Verification of the Thermal History Effect on the Flow Simulation of LCPs," SPE Technical Papers, XXXVIII, pp. 1368-1372 (1992).

H. Lobo, "A Transient Method for Thermal Conductivity Measurements of Thermosets," SPE Technical Papers, XXXVII, pp. 1281-1283 (1991).

F. Oehmke & T. Weigmann, "Verfahren zur Messung der Warmeleitfahigkeit von Kunststoffen," pp. 64-66 (1990). (in German)

F. Oehmke & T. Weigmann, "Messung der Warmeleitfahigkeit als Funktion von Temperatur und Druck," pp. 218-219 (1990). (in German)

F. Oehmke & T. Weigmann, "Dichte, Warmeleitfahigkeit und Warmekapazitat automatisiert messen," pp. 1255-1259 (1990). (in German)

S.P. McCarthy, S. Orroth & K. Shah, "Effect of Glass Fibre Orientation on the Thermal Diffusivity and Thermal Conductivity of Polymer Melts," SPE Technical Papers, XXXVI, pp. 565-568 (1990).

C.A. Hieber & K.K. Wang, "Melt-Viscosity Modelling and Its Effect upon Injection Molding Simulation," SPE Technical Papers, XXXVI, pp. 943-947 (1990).

C. Cohen & H. Lobo, "Measurement of Thermal Conductivity of Polymer Melts by the Line Source Method," Polymer Engineering & Science, Vol. 30, No. 2, pp. 65-70 (1990).

H. Lobo & R. Newman, "Thermal Conductivity of Polymers at High Temperatures & Pressures," SPE Technical Papers, XXXVI, pp. 862-864 (1990).

C. Cohen, "Materials: A High Research Priority in Chemical Engineering," Chemical Engineering Progress, pp. 27-31, (April 1989).

H.H. Chiang & C.A. Hieber, "Shear-Rate-Dependence Modeling of Polymer Melt Viscosity," SPE Technical Papers, XXXV, pp. 1209-1213 (1989).

H.H. Chiang & C.A. Hieber, "Some Correlations Involving the Shear Viscosity of Polystyrene Melts," Rheological Acta, Vol. 28, pp. 321-332 (1989).

H.H. Chiang, C.A. Hieber & K.K. Wang, "An Alternative Scheme for Bagley Correction in Capillary Rheometer," SPE Technical Papers, XXXIV, pp. 1099-1102 (1988).

C. Cohen & H. Lobo, "Measurement of Thermal Conductivity of Polymer Melts by the Line Source Method," SPE Technical Papers, XXXIV, pp. 609-611 (1988).

H.H. Chiang, C.A. Hieber, W.R. Jong, R.C. Ricketson & K.K. Wang, "Melt Viscosity Characterization via Spiral Mold," SPE Technical Papers, XXXIII, p. 938 (1987).

H.H. Chiang, G.E. Grant, C.A. Hieber, H.C. Tseng & K.K. Wang, "Analysis of Rheological Data from an Automated-Injection-Molding Capillary Rheometer," SPE Technical Papers XXXI, pp. 716-719 (1985).

Die Casting

L.S. Turng & K.K.Wang, "Rheological Behaviour and Modelling of Semi-Solid Sn-15%Pb Alloy," Journal of Materials Science, Vol. 26, pp. 2173-2183 (1991).

L.S. Turng & K.K.Wang, "Modelling the Flow and Solidification for Semi-Solid Sn-Pb Alloy," Trans. 15th International Die Casting Congress, Paper No. G-T89-043 (1989).

Basic Research In Heat & Mass Transfer

K. Himasekhar & P.K. Sarma, "Turbulent Heat Transfer from a Non-Isothermal Vertical Surface with a Power-law Temperature Variation," Journal of Thermal Engineering, Vol. 3, pp. 63-64 (1983).

K. Himasekhar & Y. Jaluria, "Buoyancy-induced Two-dimensional Vertical Flows in a Thermally Stratified Environment," Computers and Fluids: An International Journal, Vol. 11, pp. 39-49 (1983).

K. Himasekhar & Y. Jaluria, "Laminar Buoyancy-induced Axisymmetric Free Boundary Flows in a Thermally Stratified Medium," International Journal of Heat and Mass Transfer, Vol. 25, pp. 213-221 (1982).


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